A low-cost high-density substrate technology for wireless-related applications

Abstract

A thin-film on modified ceramic (TFoMC) based substrate technology for achieving high-accuracy and high-uniformity design has been developed and implemented. The integrated passive devices (IPDs), including capacitors, inductors, band-pass filters and Baluns, were realized based on the proposed TFoMC technology. The IPD characterization results were close to the HFSS simulation, and demonstrated good in-substrate uniformity at the same time. The thermal shock and unbiased autoclave measurements were also carried out to evaluate the reliability of the technology. After 1000-cycle thermal shock and 96-hour autoclave storage, the IPDs exhibited no performance degradation, indicating the excellent substrate reliability and making it a promising technology for the wireless-related applications.