Effect of Pressure and Temperature on Dielectric Response of Silicone Composites

K. Khanum, Arathi Mohan Sharma, S. Jayaram
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Abstract

Use of lightweight polymeric materials in aircraft insulation, leads to reduction in overall weight as well as aids in improved performance. However, for successful implementation of these polymeric materials, specific studies in terms of, improvement in processability, performance evaluation due to variation in pressure and temperature, are required. In this study, silicone rubber filled with silica of different particle size; micrometer and nanometer are considered, and the fillers are loaded to the maximum possible weight percent. An in-house built electrostatic disperser is employed to homogeneously disperse the fillers within the silicone matrix. The thermal and dielectric properties are compared and analyzed with changes in temperature and pressure.
压力和温度对有机硅复合材料介电响应的影响
在飞机绝缘中使用轻质聚合物材料,可以减少总重量,并有助于提高性能。然而,为了成功地实施这些聚合物材料,需要在可加工性的改进方面进行具体的研究,以及由于压力和温度变化而进行的性能评估。在本研究中,硅橡胶填充不同粒径的二氧化硅;考虑微米级和纳米级,并将填料加载到最大可能的重量百分比。内部建造的静电分散器用于均匀分散硅基内的填料。在温度和压力变化的情况下,对其热性能和介电性能进行了比较分析。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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