Wideband Suppression of Radiated Emissions from a Power Bus in High-Speed Printed Circuit Boards

Yujeong Shim, Myunghoi Kim
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Abstract

We present experimental demonstrations of electromagnetic bandgap (EBG) structures for the wideband suppression of radiated emissions from a power bus in high-speed printed circuit boards (PCBs). In most of the PCB designs, a parallel plate waveguide (PPW) structure is employed for a power bus. This structure significantly produces the wideband-radiated emissions resulting from parallel plate modes. To suppress the parallel plate modes in the wideband frequency range, the power buses based on the electromagnetic bandgap structure with a defected ground structure (DGS) are presented. DGSs are applied to a metal plane that is connected to a rectangular EBG patch by using a via structure. The use of the DGS increases the characteristic impedance value of a unit cell, thereby substantially improving the suppression bandwidth of the radiated emissions. It is experimentally demonstrated that the DGS–EBG structure significantly mitigates the radiated emissions over the frequency range of 0.5 GHz to 2 GHz as compared to the PPW.
高速印刷电路板中电源母线辐射发射的宽带抑制
我们提出了电磁带隙(EBG)结构的实验演示,用于高速印刷电路板(pcb)中电源总线的宽带抑制辐射发射。在大多数PCB设计中,电源总线采用平行板波导(PPW)结构。这种结构显著地产生了由平行板模引起的宽带辐射发射。为了抑制宽带频率范围内的平行平板模式,提出了一种基于缺陷接地结构(DGS)的电磁带隙结构的电源母线。dgs应用于金属平面,该平面通过通孔结构连接到矩形EBG贴片。DGS的使用增加了单元格的特性阻抗值,从而大大提高了辐射发射的抑制带宽。实验证明,与PPW相比,DGS-EBG结构在0.5 GHz ~ 2 GHz频率范围内显著减轻了辐射发射。
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