Advanced CMOS Integration Technologies for Future Mobile Applications

Abstract

Future mobile communication systems and 5G base stations are relying on the availability of a variety of high-speed high-performing semiconductor technologies. Not only advanced CMOS technologies will form the cornerstone but also innovative heterogeneous technologies manufactured on a Si platform will be needed for future System-on-Chip applications. III-nitrides will play an important role in the RF and power parts. While increased system functionality and density can be achieved by 3D integration based on Through Silicon Vias, a strong focus is nowadays going to the monolithic or 3D sequential integration on a Si substrate. Several of these different technologies are reviewed and discussed.