R. D. Brown, J. Boggs, R. Hilderbrandt, K. Lim, I. Mills, E. Niktin, M. Palmer
{"title":"(DID","authors":"R. D. Brown, J. Boggs, R. Hilderbrandt, K. Lim, I. Mills, E. Niktin, M. Palmer","doi":"10.1515/iupac.68.0683","DOIUrl":null,"url":null,"abstract":"","PeriodicalId":215902,"journal":{"name":"Ceramic Materials for Electronics","volume":"233 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Ceramic Materials for Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1515/iupac.68.0683","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}