Roughness characterization of gate all around Silicon Nano Wire fabrication

S. Levi, I. Schwarzband, R. Kris, O. Adan
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引用次数: 3

Abstract

In this paper we present a new methodology to calibrate and correct in line roughness measurements for Silicon Nano Wires (SiNW) fabrication processes. For successful implementation of these processes in industry, the Silicon Nano Wires (SiNW) with widths of 5-25 nm should be characterized in the framework of Secondary Electron Microscope(CD SEM) Metrology. Different smoothing processes yield SiNWs with edge roughness values in the sub nanometer range[1]. Such small differences in roughness values provide an interesting opportunity to evaluate sensitivity of the SEM metrology algorithms and measurement accuracy. A simulation program modeling SEM images including small features was developed, taking into account the main factors that affect the SEM signal formation. Synthetic (simulated) images of SiNW in a range of 5-25 nm and roughness of 0-1 nm were produced. Using synthetic images with added Line Edge Roughness (LER), we characterized the performance and sensitivity of LER algorithms and CD metrics.
栅极周围硅纳米线制造的粗糙度表征
本文提出了一种新的方法来校准和纠正硅纳米线(SiNW)制造过程中的线粗糙度测量。为了在工业上成功实施这些工艺,宽度为5-25 nm的硅纳米线(SiNW)应该在二级电子显微镜(CD SEM)计量的框架下进行表征。不同的平滑工艺得到边缘粗糙度值在亚纳米范围[1]的sinw。粗糙度值的微小差异为评估SEM计量算法的灵敏度和测量精度提供了一个有趣的机会。考虑影响扫描电镜信号形成的主要因素,开发了包含小特征的扫描电镜图像仿真程序。合成(模拟)SiNW的图像范围为5-25 nm,粗糙度为0-1 nm。利用添加了线边缘粗糙度(Line Edge Roughness, LER)的合成图像,对LER算法和CD指标的性能和灵敏度进行了表征。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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