FUNDAMENTALLY NEW APPROACHES TO SOLVING THERMOPHYSICAL PROBLEMS IN THE FIELD OF NANOELECTRONICS

Mathematical modeling in materials science of electronic component Pub Date : 2021-10-27 DOI:10.29003/m2481.mmmsec-2021/92-94

V. Khvesyuk, A. Barinov, B. Liu, W. Qiao

引用次数: 0

Abstract

The paper discusses current problems related to the heat transfer in solid-state nanostructures: the influence of real rough boundaries on the effective thermal conductivity and contact thermal resistance

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从根本上解决纳米电子学领域热物理问题的新方法

本文讨论了当前固体纳米结构传热的相关问题:实际粗糙边界对有效导热系数和接触热阻的影响

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Mathematical modeling in materials science of electronic component

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