A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling

Abstract

In this paper, we propose a new board-to-board connector design for 5G mmWave and high-speed signaling. The proposed board-to-board connector has a socket shield and mid-plate between pins. The socket shell reduces electromagnetic interference (EMI), emitted to the outside and the mid-plate reduces crosstalk between terminals. We verified the signal integrity performance and EMI reduction effect of the newly added ground structures through EM simulation. However, due to the increased ground structure, the return current path of the signal is split, and resonances are generated. We analyzed the resonances through the J-field change according to the frequencies.