Finite Element Analysis of the Advanced Photo System Bubble Spring Head/Film Interface

Abstract

This paper describes the finite element model used to predict the spacing and contact pressure in an Advanced Photo System head/film interface. The particular interface analyzed was developed for use in photofinishing applications and is commonly referred to as a bubble spring interface, named after the flexure-like thin metal strip used to push the film against the magnetic head. The model results are validated by comparing predictions to measurements of the spring load-deflection profile and interferometrically measured head-to-film spacing contours. In addition, the model’s capability is demonstrated by using it to assess performance sensitivity to variations in spring load, head/film penetration, and film curl.