Comparison of Electrical Properties of CuCr30 Contacts Manufactured by Two Powder Metallurgy Technologies

Kaimiao Liu, Peng Li, Shisong Zhang, Xiaojun Wang, Gang Li, Xiaoyun Shi, Wenbin Wang
{"title":"Comparison of Electrical Properties of CuCr30 Contacts Manufactured by Two Powder Metallurgy Technologies","authors":"Kaimiao Liu, Peng Li, Shisong Zhang, Xiaojun Wang, Gang Li, Xiaoyun Shi, Wenbin Wang","doi":"10.1109/HLM51431.2021.9671098","DOIUrl":null,"url":null,"abstract":"The powder metallurgy CuCr contacts has excellent anti-welding performance, thus it is often used in low contact pressure Vacuum Interrupters (VIs), which are typically used in VIs commercially made by Russia. Compared with the CuCr contact which is made by the arc melting or vacuum melting, the disadvantage of powder metallurgy CuCr contact is that its current breaking capacity is low. This research focused on an improvement of breaking capacity of CuCr30 contacts by using Spark Plasma Sintering (SPS) sintering process. The current breaking capacity and welding strength was compared with conventional powder metallurgy CuCr30 contacts. The experimental results showed that the SPS sintering process improved the electrical life. The conventional powder metallurgy processed CuCr30 contacts successfully interrupted short circuit current of …kA with 13 times, while the SPS process sintered CuCr30 contacts reached 19 times, even though it is still lower than that of the vacuum melting CuCr30 contacts (22 times) and the arc melting process contacts (23 times). The average welding force of the conventional powder metallurgy and SPS processes CuCr30 contact were 441.8N and 348.9N, respectively.","PeriodicalId":338653,"journal":{"name":"2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE 66th Holm Conference on Electrical Contacts (HLM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/HLM51431.2021.9671098","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

The powder metallurgy CuCr contacts has excellent anti-welding performance, thus it is often used in low contact pressure Vacuum Interrupters (VIs), which are typically used in VIs commercially made by Russia. Compared with the CuCr contact which is made by the arc melting or vacuum melting, the disadvantage of powder metallurgy CuCr contact is that its current breaking capacity is low. This research focused on an improvement of breaking capacity of CuCr30 contacts by using Spark Plasma Sintering (SPS) sintering process. The current breaking capacity and welding strength was compared with conventional powder metallurgy CuCr30 contacts. The experimental results showed that the SPS sintering process improved the electrical life. The conventional powder metallurgy processed CuCr30 contacts successfully interrupted short circuit current of …kA with 13 times, while the SPS process sintered CuCr30 contacts reached 19 times, even though it is still lower than that of the vacuum melting CuCr30 contacts (22 times) and the arc melting process contacts (23 times). The average welding force of the conventional powder metallurgy and SPS processes CuCr30 contact were 441.8N and 348.9N, respectively.
两种粉末冶金工艺制备CuCr30触头电性能比较
由于粉末冶金CuCr触点具有优良的抗焊接性能,因此常用于低触点压力真空灭弧器(VIs)中,而低触点压力真空灭弧器通常用于俄罗斯的商业化灭弧器。与电弧熔炼或真空熔炼的CuCr触点相比,粉末冶金CuCr触点的缺点是分断电流能力低。研究了采用火花等离子烧结(SPS)工艺提高CuCr30触头的分断能力。对比了常规粉末冶金CuCr30触头的断电流能力和焊接强度。实验结果表明,SPS烧结工艺提高了材料的电寿命。传统粉末冶金工艺处理CuCr30触点成功中断短路电流为…kA的13次,而SPS工艺烧结CuCr30触点达到19次,尽管仍低于真空熔融CuCr30触点(22次)和电弧熔化工艺触点(23次)。常规粉末冶金和SPS工艺CuCr30接触的平均焊接力分别为441.8N和348.9N。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信