Built-in self-calibration of CMOS-compatible thermopile sensor with on-chip electrical stimulus

Jia Li, Zhuolei Huang, Weibing Wang
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引用次数: 4

Abstract

MEMS devices are expected to be used in a growing number of high-volume and low-cost applications. However because they usually require complex test stimuli rather than simple digital electronic signals as common VLSI systems to verify their specifications, testing and calibration costs have actually become a bottleneck to reduce the overall production cost of MEMS sensors. To address this issue, this paper presents an on-chip scheme to calibrate the responsivity of infrared thermopile temperature sensor with digital control signals. With the proposed method, the responsivity related to the ambient temperature can be calibrated before the target temperature being measured thus to achieve accurate temperature measurement. The proposed self-calibrating thermopile sensor design has been realized by CMOS-compatible process to prove the effectiveness of the self-calibration temperature measurement method.
内置自校准cmos兼容热电堆传感器与片上电刺激
MEMS器件预计将用于越来越多的大批量和低成本应用。然而,由于它们通常需要复杂的测试刺激,而不是像普通的VLSI系统那样需要简单的数字电子信号来验证其规格,因此测试和校准成本实际上已经成为降低MEMS传感器整体生产成本的瓶颈。针对这一问题,本文提出了一种利用数字控制信号对红外热电堆温度传感器的响应度进行片上标定的方案。利用该方法,可以在测量目标温度之前校准与环境温度相关的响应度,从而实现精确的温度测量。采用cmos兼容工艺实现了自校准热电堆传感器的设计,验证了自校准测温方法的有效性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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