Reduction of the Feedback Capacitance of HFETs by Changing Transistor Layout and Using Via Holes for Source Grounding

N. Rorsman, M. Garcia, C. Karlsson, H. Zirath
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引用次数: 3

Abstract

The influence of HFET layout and via holes on the feedback capacitance of passive and non-gated as well as active HFETs has been examined. We have found that by careful design of the layout of the HFET and using via-hole for source grounding it is possible to reduce the feedback capacitance, thus improving the high frequency characteristics of the HFET. The total feedback capacitance was reduced by 70 % for a passive device with via holes and by varying one layout parameter. Results on active InP-based HFETs without via-holes show a total decrease of the feedback capacitance of 40 % for an InAlAs/InGaAs/InP HFET. The maximum stable gain at 40 GHz for an InAlAs/InGaAs/InP HFET. Was increased by 1.5 dB by changing the layout.
通过改变晶体管布局和采用通孔源地来减小高频场效应管的反馈电容
研究了HFET布局和通孔对无源、非门控和有源HFET反馈电容的影响。我们发现,通过精心设计HFET的布局并使用过孔作为源地,可以减少反馈电容,从而改善HFET的高频特性。对于有过孔的无源器件,通过改变一个布局参数,总反馈电容降低了70%。无过孔的有源InP基HFET的结果表明,InAlAs/InGaAs/InP HFET的反馈电容总体降低了40%。InAlAs/InGaAs/InP HFET在40ghz时的最大稳定增益。通过改变布局增加了1.5 dB。
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