Condition Monitoring of Power Electronic Converters: Present Status and Key Challenges

Abstract

The reliability and life of a device can be improved by an effective condition monitoring technique. A Power Electronic Converter (PEC) consists of components, such as IGBTs, capacitors, and gate-drive circuits. These components are subject to failure due to their continuous operation in different operating conditions. The failure of any of these components can lead to the subsequent failure of other components and, eventually, the failure of the entire PEC. This paper reviews the present status in condition monitoring of the IGBT, solder, and capacitor in a PEC and also emphasizes on the key challenges of these techniques so as to develop an appropriate condition monitoring technique by proper academic research. The deviation in gate voltage-time characteristics, ON-state voltage, thermal resistance, and switching time of IGBT, are detected using various methods. Sensor and vibration-based methods are also discussed to monitor the condition of the bond wire. In addition, different methods are discussed to measure the capacitance value or Equivalent Series Resistance (ESR) value of a capacitor to judge its condition. Deviation of these values from a threshold helps in early detection and replacement before the occurrence of a fault. The benefits and limitations of these methods are also highlighted. Finally, the key issues and challenges in the condition monitoring of PECs are presented.