Modeling whispering gallery mode III–V micro-lasers monolithically integrated on Silicon

S. Sant, A. Schenk, B. Mayer, S. Wirths, S. Mauthe, H. Schmid, K. Moselund
{"title":"Modeling whispering gallery mode III–V micro-lasers monolithically integrated on Silicon","authors":"S. Sant, A. Schenk, B. Mayer, S. Wirths, S. Mauthe, H. Schmid, K. Moselund","doi":"10.1109/NUSOD.2018.8570258","DOIUrl":null,"url":null,"abstract":"The vision to speed up on-chip data communication by signal multiplexing using light and the promise to reduce the energy consumption of interconnects using optoelectronic devices has boosted on-chip photonics during the past years. Silicon is an ideal material for optical waveguides and passives, but due to the indirect band gap it is an inefficient emitter. Promising techniques to integrate III-V optoelectronic devices on Si were recently reported using selective area growth in trenches [1], in pre-patterned V-grooves [2], and using template assisted selective epitaxy (TASE) [3] all of which yield optically pumped micro-lasers. Geometric scaling of the photonic devices improves power efficiency due to reduced RC constant, but it is challenging to contact the scaled-down photonic devices. In this work, we employ coupled optoelectronic simulations to evaluate different paths for electrical pumping of our own optically pumped microlasers [3] while considering the constraints given by our process.","PeriodicalId":316299,"journal":{"name":"2018 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2018 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NUSOD.2018.8570258","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

The vision to speed up on-chip data communication by signal multiplexing using light and the promise to reduce the energy consumption of interconnects using optoelectronic devices has boosted on-chip photonics during the past years. Silicon is an ideal material for optical waveguides and passives, but due to the indirect band gap it is an inefficient emitter. Promising techniques to integrate III-V optoelectronic devices on Si were recently reported using selective area growth in trenches [1], in pre-patterned V-grooves [2], and using template assisted selective epitaxy (TASE) [3] all of which yield optically pumped micro-lasers. Geometric scaling of the photonic devices improves power efficiency due to reduced RC constant, but it is challenging to contact the scaled-down photonic devices. In this work, we employ coupled optoelectronic simulations to evaluate different paths for electrical pumping of our own optically pumped microlasers [3] while considering the constraints given by our process.
模拟耳语廊模式III-V微激光器单片集成在硅上
在过去的几年里,通过光的信号复用来加速片上数据通信的愿景,以及使用光电子设备减少互连能耗的承诺,推动了片上光子学的发展。硅是一种理想的光波导和无源材料,但由于间接带隙,它是一种低效的发射器。最近报道了将III-V光电子器件集成到Si上的有前途的技术,包括在沟槽中选择性面积生长[1],在预图图化的v型凹槽中[2],以及使用模板辅助选择性外延(TASE)[3],所有这些技术都可以产生光泵浦微激光器。光子器件的几何缩放降低了RC常数,从而提高了功率效率,但与按比例缩小的光子器件接触是一个挑战。在这项工作中,我们采用耦合光电模拟来评估我们自己的光泵浦微激光器的不同电泵浦路径[3],同时考虑到我们的工艺给出的约束。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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