Space based radar on-board processing architecture

S. Vaillancourt
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引用次数: 2

Abstract

This paper describes system-level issues and solutions for space-based radar on-board processing. A modular, upgradeable architecture has been defined and SEAKR Engineering has built three module types as a risk-reduction effort. The memory modules are scalable to 128 Gbits/board with 16 Gbps of I/O capacity. The processing element boards are FPGA-based and use five Xilinx Virtex-II Pro-70 parts. Four FPGAs each have four banks of 18Mbit fast SRAM and the fifth FPGA has 512 MBytes of SDRAM. There are 10 Gbps interconnects between the FPGAs and two 8Gbps external I/O ports. The network switch module is based on RapidIO with the first version handling 4 bidirectional ports with 8Gbps full duplex per port. System partitioning and thermal issues have led to the use of heat pipes for hot parts and advanced materials for the chassis. The system power supply has also been considered to provide 1000 Watts from the system bus to the high-current, low voltages used by the advanced deep sub-micron parts
天基雷达机载处理体系结构
本文介绍了天基雷达机载处理的系统级问题和解决方案。已经定义了一个模块化的、可升级的体系结构,SEAKR工程公司已经构建了三种模块类型,以降低风险。内存模块可扩展到128 gbit /board,具有16 Gbps的I/O容量。处理电路板基于fpga,使用5个Xilinx Virtex-II Pro-70部件。四个FPGA各有四组18Mbit快速SRAM,第五个FPGA具有512 mb的SDRAM。fpga和两个8Gbps的外部I/O端口之间有10gbps的互连。网络交换模块基于RapidIO,第一个版本处理4个双向端口,每个端口8Gbps全双工。系统分区和热问题导致热部件使用热管,底盘使用先进材料。系统电源也被考虑提供1000瓦从系统总线到高电流,低电压使用的先进深亚微米部件
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