3-D MIMO-SAR Imaging Using Multi-Chip Cascaded Millimeter-Wave Sensors

Muhammet Emin Yanik, Dan Wang, M. Torlak
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引用次数: 32

Abstract

Integration of multi-chip cascaded multiple-input multiple-output (MIMO) millimeter-wave (mmWave) sensors with synthetic aperture radar (SAR) imaging will enable cost-effective and scalable solutions for a variety of applications including security, automotive, and surveillance. In this paper, the first three-dimensional (3-D) holographic MIMO-SAR imaging system using cascaded mmWave sensors is designed and implemented. The challenges imposed by the use of cascaded mmWave sensors in high-resolution MIMO-SAR imaging systems are discussed. Especially, important signal processing functions such as near-field multistatic image reconstruction suitable for large MIMO apertures, multi-channel array calibration, spatial sampling, and image resolution are presented in the context of 3-D MIMO-SAR imaging. The prototyped 3-D MIMO-SAR imaging system is described in detail, along with various real imaging results.
基于多芯片级联毫米波传感器的三维MIMO-SAR成像
多芯片级联多输入多输出(MIMO)毫米波(mmWave)传感器与合成孔径雷达(SAR)成像的集成将为安全、汽车和监控等各种应用提供经济高效且可扩展的解决方案。本文设计并实现了首个基于级联毫米波传感器的三维全息MIMO-SAR成像系统。讨论了在高分辨率MIMO-SAR成像系统中使用级联毫米波传感器所带来的挑战。特别是在三维MIMO- sar成像的背景下,提出了适用于大孔径MIMO的近场多静态图像重建、多通道阵列校准、空间采样和图像分辨率等重要的信号处理功能。详细描述了原型三维MIMO-SAR成像系统,以及各种实际成像结果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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