A surface integral equation method for solving complicated electrically small structures

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710) Pub Date : 2003-12-08 DOI:10.1109/EPEP.2003.1250064

Y. Chu, W. Chew

引用次数: 10

Abstract

A surface integral equation (SIE) method based on contact-region modeling is applied for complicated electrically small structures in packaging and interconnect analysis. LF-MLFMA is employed to solve the matrix equation with O(N) computational cost.

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求解复杂电小结构的表面积分方程法

将基于接触区域建模的表面积分方程(SIE)方法应用于封装和互连中复杂电小结构的分析。采用LF-MLFMA求解矩阵方程，计算代价为0 (N)。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)

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