Substrate Integrated Metal-Via Array Horn Antenna

Yezhou Yang, Zhipeng Zhou, Guo-peng Yang, Jin-ping Zhang
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引用次数: 2

Abstract

A substrate integrated waveguide (SIW) embedded metal-via array H-plane horn antenna with slots is presented. With additional via and a pair of slots etched on metallization, antenna gain is higher and the bandwidth is wider. Simulation shows that the enhanced gain of 7.74dBi at 35GHz is obtained and the widen impedance bandwidth is 15.7% from 32.10 to 37.60GHz, whereas the simulated gain of the conventional antenna is 4.86dBi. The proposed antenna also shows a suppressed back-lobe radiation with a 34 dB front-to-back (FTB) ratio.
基板集成金属通孔阵列喇叭天线
提出了一种嵌入金属通孔阵列的基板集成波导槽型h面喇叭天线。通过额外的通孔和金属化蚀刻的一对槽,天线增益更高,带宽更宽。仿真结果表明,与传统天线的仿真增益4.86dBi相比,该天线在35GHz时的增益增强了7.74dBi,在32.10 ~ 37.60GHz范围内的阻抗带宽提高了15.7%。该天线还显示出34 dB的前后(FTB)比抑制的后瓣辐射。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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