{"title":"Substrate Integrated Metal-Via Array Horn Antenna","authors":"Yezhou Yang, Zhipeng Zhou, Guo-peng Yang, Jin-ping Zhang","doi":"10.1109/IEEE-IWS.2019.8803953","DOIUrl":null,"url":null,"abstract":"A substrate integrated waveguide (SIW) embedded metal-via array H-plane horn antenna with slots is presented. With additional via and a pair of slots etched on metallization, antenna gain is higher and the bandwidth is wider. Simulation shows that the enhanced gain of 7.74dBi at 35GHz is obtained and the widen impedance bandwidth is 15.7% from 32.10 to 37.60GHz, whereas the simulated gain of the conventional antenna is 4.86dBi. The proposed antenna also shows a suppressed back-lobe radiation with a 34 dB front-to-back (FTB) ratio.","PeriodicalId":306297,"journal":{"name":"2019 IEEE MTT-S International Wireless Symposium (IWS)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE MTT-S International Wireless Symposium (IWS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEEE-IWS.2019.8803953","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A substrate integrated waveguide (SIW) embedded metal-via array H-plane horn antenna with slots is presented. With additional via and a pair of slots etched on metallization, antenna gain is higher and the bandwidth is wider. Simulation shows that the enhanced gain of 7.74dBi at 35GHz is obtained and the widen impedance bandwidth is 15.7% from 32.10 to 37.60GHz, whereas the simulated gain of the conventional antenna is 4.86dBi. The proposed antenna also shows a suppressed back-lobe radiation with a 34 dB front-to-back (FTB) ratio.