Chip-embedded Glass Interposer for 5G Applications

Abstract

This paper presents the implementation of a chip-embedded glass interposer targeting 5G applications. Two approaches for low-loss interconnect design on the interposer are demonstrated for the first time on 5G bands by modeling, fabrication, and measurements. Enabled by the interconnects, the fabricated chip-embedded interposer performs low loss and wideband matching over 40 GHz. The excellent performance proves the chip-embedded glass interposer a promising package solution for 5G front-end modules.