E. Cartier, V. Narayanan, E. Gusev, P. Jamison, B. Linder, M. Steen, K. Chan, M. Frank, N. Bojarczuk, M. Copel, S. Cohen, S. Zafar, A. Callegari, M. Gribelyuk, M. Chudzik, C. Cabral, R. Carruthers, C. D'Emic, J. Newbury, D. Lacey, S. Guha, R. Jammy
{"title":"Systematic study of pFET V/sub t/ with Hf-based gate stacks with poly-Si and FUSI gates","authors":"E. Cartier, V. Narayanan, E. Gusev, P. Jamison, B. Linder, M. Steen, K. Chan, M. Frank, N. Bojarczuk, M. Copel, S. Cohen, S. Zafar, A. Callegari, M. Gribelyuk, M. Chudzik, C. Cabral, R. Carruthers, C. D'Emic, J. Newbury, D. Lacey, S. Guha, R. Jammy","doi":"10.1109/VLSIT.2004.1345383","DOIUrl":null,"url":null,"abstract":"The flatband/threshold voltages (V/sub fb//V/sub t/) in poly-Si gated pFETs with Hf-based gate dielectrics are shown to be set during poly-Si deposition and are found to remain virtually unchanged during gate implantation and activation, independent of the p-type dopant. The reaction of Si with HfO/sub 2/ at poly-Si deposition temperatures is identified as the root cause for the poor V/sub fb//V/sub t/ control. No improvement in V/sub t/ control is obtained by engineering physically closed Si/sub 3/N/sub 4/ barrier layers on HfO/sub 2/. It is furthermore shown for the first time that even when the gate is fully silicided (FUSI) large V/sub fb//V/sub t/ shifts are observed with HfO/sub 2/. Reduced pFET shifts are observed when Hf-silicates with low Hf content are used and further improvements are observed by using Al/sub 2/O/sub 3/ cap layers on silicates.","PeriodicalId":297052,"journal":{"name":"Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004.","volume":"48 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"25","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Digest of Technical Papers. 2004 Symposium on VLSI Technology, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2004.1345383","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 25
Abstract
The flatband/threshold voltages (V/sub fb//V/sub t/) in poly-Si gated pFETs with Hf-based gate dielectrics are shown to be set during poly-Si deposition and are found to remain virtually unchanged during gate implantation and activation, independent of the p-type dopant. The reaction of Si with HfO/sub 2/ at poly-Si deposition temperatures is identified as the root cause for the poor V/sub fb//V/sub t/ control. No improvement in V/sub t/ control is obtained by engineering physically closed Si/sub 3/N/sub 4/ barrier layers on HfO/sub 2/. It is furthermore shown for the first time that even when the gate is fully silicided (FUSI) large V/sub fb//V/sub t/ shifts are observed with HfO/sub 2/. Reduced pFET shifts are observed when Hf-silicates with low Hf content are used and further improvements are observed by using Al/sub 2/O/sub 3/ cap layers on silicates.