On-the-fly timing-aware built-in self-repair for high-speed interposer wires in 2.5-D ICs

Abstract

Interposer is a critical component in a 2.5-D IC as it serves as a common platform upon which multiple known good dies are bonded. Any defect in an interposer will lead to a loss of compound yield. To avoid such a last-minute yield loss, we propose a timing-aware Built-In Self-Repair method to increase the fault tolerance of high-speed interposer wires. The most unique feature of our method as compared to previous works is that ours can repair not only catastrophic faults, but also timing faults. We present an on-the-fly test-and-repair flow that can seamlessly link Pulse-Vanishing Test, a previous timing-aware interconnect test method, with a popular redundancy structure.