Development of Electroless Ni-P Plating Film for Power Modules

Abstract

So far, we investigated the influence of phosphorus content and Sulfur content in electroless Ni-P plating films on film properties. As a result, we reported that the film containing low phosphorus content and containing no Sulfur is less susceptible to embrittlement during heat treatment. However, in the films reported so far, there are cases where sufficient cracks resistance cannot be obtained when the heat treatment temperature is 350 °C. Therefore, in this paper, we report on the development of a film which does not have cracks even after heat treatment at 400 °C by no Sulfur and low phosphorus content than films reported so far.