3D heterogeneous integration enabling future RF ICs

Abstract

High-performance radio frequency integrated circuit (RF ICs) is the core of wireless systems. While CMOS scaling and integration have been beneficial to modern RF ICs, future RF ICs call for More-Than-Moore technologies. This paper reviews recent advances in developing enabling 3D heterogeneous integration technologies for next-generation RF ICs, including vertical magnetic-cored inductors, through-back-end-of-line (BEOL) metal wall crosstalk isolation and above-IC graphene switch electrostatic discharging (ESD) protection.