Highly functional and reliable 8Mb STT-MRAM embedded in 28nm logic

Y. Song, J. Lee, H. Shin, K. H. Lee, K. Suh, J. R. Kang, S. Pyo, H. Jung, S. Hwang, G. Koh, Sechung Oh, Soojeoung Park, Jinhak Kim, Jae-Kyun Park, Ju-Sik Kim, K. Hwang, G. Jeong, K. Lee, E. Jung
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引用次数: 84

Abstract

We fabricated 8Mb 1T-1MTJ STT-MRAM macro embedded in 28nm CMOS logic platform by developing novel integration/stack/patterning technologies. MTJ memory cell array was successfully embedded into Cu backend without open fail and severe degradation of magnetic property. Advanced perpendicular MTJ stack using MgO/CoFeB was developed to show high TMR value of 180% after full integration. In addition, ion beam etching (IBE) process was optimized with power, angle, and pressure to reduce a short fail below 1 ppm. Through these novel technologies, we demonstrated highly functional and reliable 8Mb eMRAM macro having a wide sensing margin and strong retention property of 85 0C and 10yrs.
高功能和可靠的8Mb STT-MRAM嵌入在28nm逻辑
我们通过开发新的集成/堆栈/图像化技术,在28nm CMOS逻辑平台上制造了8Mb 1T-1MTJ STT-MRAM宏。MTJ存储单元阵列成功嵌入Cu后端,没有出现开放性失效和严重的磁性退化。开发了采用MgO/CoFeB的先进垂直MTJ堆栈,完全集成后TMR值高达180%。此外,对离子束蚀刻(IBE)工艺进行了功率、角度和压力等方面的优化,使短失效率降低到1ppm以下。通过这些新技术,我们展示了高功能和可靠的8Mb eMRAM宏,具有宽传感裕度和85℃和10年的强保留性能。
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