Y. Song, J. Lee, H. Shin, K. H. Lee, K. Suh, J. R. Kang, S. Pyo, H. Jung, S. Hwang, G. Koh, Sechung Oh, Soojeoung Park, Jinhak Kim, Jae-Kyun Park, Ju-Sik Kim, K. Hwang, G. Jeong, K. Lee, E. Jung
{"title":"Highly functional and reliable 8Mb STT-MRAM embedded in 28nm logic","authors":"Y. Song, J. Lee, H. Shin, K. H. Lee, K. Suh, J. R. Kang, S. Pyo, H. Jung, S. Hwang, G. Koh, Sechung Oh, Soojeoung Park, Jinhak Kim, Jae-Kyun Park, Ju-Sik Kim, K. Hwang, G. Jeong, K. Lee, E. Jung","doi":"10.1109/IEDM.2016.7838491","DOIUrl":null,"url":null,"abstract":"We fabricated 8Mb 1T-1MTJ STT-MRAM macro embedded in 28nm CMOS logic platform by developing novel integration/stack/patterning technologies. MTJ memory cell array was successfully embedded into Cu backend without open fail and severe degradation of magnetic property. Advanced perpendicular MTJ stack using MgO/CoFeB was developed to show high TMR value of 180% after full integration. In addition, ion beam etching (IBE) process was optimized with power, angle, and pressure to reduce a short fail below 1 ppm. Through these novel technologies, we demonstrated highly functional and reliable 8Mb eMRAM macro having a wide sensing margin and strong retention property of 85 0C and 10yrs.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"84","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838491","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 84
Abstract
We fabricated 8Mb 1T-1MTJ STT-MRAM macro embedded in 28nm CMOS logic platform by developing novel integration/stack/patterning technologies. MTJ memory cell array was successfully embedded into Cu backend without open fail and severe degradation of magnetic property. Advanced perpendicular MTJ stack using MgO/CoFeB was developed to show high TMR value of 180% after full integration. In addition, ion beam etching (IBE) process was optimized with power, angle, and pressure to reduce a short fail below 1 ppm. Through these novel technologies, we demonstrated highly functional and reliable 8Mb eMRAM macro having a wide sensing margin and strong retention property of 85 0C and 10yrs.