4.1 Introduction

A. Kennedy, J. Simpson, Pankaj Kumar, Ayenda Kemp, K. Awate, K. Manning
{"title":"4.1 Introduction","authors":"A. Kennedy, J. Simpson, Pankaj Kumar, Ayenda Kemp, K. Awate, K. Manning","doi":"10.14361/9783839452431-015","DOIUrl":null,"url":null,"abstract":"In Chapter 1 we learned how to make chips that work. Now we move on to making chips that work well, where \" well \" can be defined as fast, low in power, inexpensive to manufacture , reliable, etc. Before we can choose which design alternative is best, we must develop ways to estimate the goodness of each option, especially with regard to speed and power consumption. The most obvious way to characterize a circuit is through simulation, and that will be the topic of Chapter 5. Unfortunately, simulations only inform us how a particular circuit behaves, not how to change the circuit to make it better. Moreover, if we don't know approximately what the result of the simulation should be, we are unlikely to catch bugs in our simulation model. Mediocre engineers rely predominantly on computer tools, but outstanding engineers develop their physical intuition to rapidly estimate the behavior of circuits. In this chapter we are primarily concerned with the development of simple models that will assist us in the understanding of system performance. In a modern process, interconnect performance can be as important as or even more important than transistor performance. The issues to be considered in this chapter are Delay estimation in CMOS gates Power dissipation of CMOS logic Interconnect delay and signal integrity Design margining Reliability Effects of scaling","PeriodicalId":263614,"journal":{"name":"Curating Contemporary Music Festivals","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-12-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Curating Contemporary Music Festivals","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.14361/9783839452431-015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

In Chapter 1 we learned how to make chips that work. Now we move on to making chips that work well, where " well " can be defined as fast, low in power, inexpensive to manufacture , reliable, etc. Before we can choose which design alternative is best, we must develop ways to estimate the goodness of each option, especially with regard to speed and power consumption. The most obvious way to characterize a circuit is through simulation, and that will be the topic of Chapter 5. Unfortunately, simulations only inform us how a particular circuit behaves, not how to change the circuit to make it better. Moreover, if we don't know approximately what the result of the simulation should be, we are unlikely to catch bugs in our simulation model. Mediocre engineers rely predominantly on computer tools, but outstanding engineers develop their physical intuition to rapidly estimate the behavior of circuits. In this chapter we are primarily concerned with the development of simple models that will assist us in the understanding of system performance. In a modern process, interconnect performance can be as important as or even more important than transistor performance. The issues to be considered in this chapter are Delay estimation in CMOS gates Power dissipation of CMOS logic Interconnect delay and signal integrity Design margining Reliability Effects of scaling
4.1介绍
在第一章中,我们学习了如何制作工作芯片。现在我们转向制造性能良好的芯片,这里的“性能良好”可以定义为速度快、功耗低、制造成本低、可靠等。在我们选择哪个设计方案是最好的之前,我们必须找到方法来评估每个方案的优点,特别是在速度和功耗方面。表征电路最明显的方法是通过仿真,这将是第5章的主题。不幸的是,模拟只告诉我们一个特定的电路是如何工作的,而不是如何改变电路使其更好。此外,如果我们不知道模拟的近似结果应该是什么,我们就不可能捕捉到模拟模型中的错误。平庸的工程师主要依靠计算机工具,但杰出的工程师发展他们的物理直觉来快速估计电路的行为。在本章中,我们主要关注简单模型的开发,这些模型将帮助我们理解系统性能。在现代工艺中,互连性能与晶体管性能一样重要,甚至比晶体管性能更重要。本章要考虑的问题是CMOS门的延迟估计CMOS逻辑的功耗互连延迟和信号完整性设计边际可靠性缩放的影响
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信