{"title":"From PC Multimedia Chipsets to Digital Consumer SOC: Evolution and Challenges","authors":"M. Tsai","doi":"10.1109/ASSCC.2006.357839","DOIUrl":null,"url":null,"abstract":"This presentation starts with evolution of the optical-storage chipsets for PC multimedia towards full-blown, next-generation SOC for digital consumer applications. Design challenges are reviewed and explored from submicron to nanometer eras in multiple levels of technology developments such as market-driven software/applications, advanced system architecture and engineering to address computation and connectivity requirements, performance-demanding but power-efficient circuit and functional blocks and the growing complexity being faced by increasingly large-scale chip integration. SOC companies will need to effectively cope with all incurred engineering issues to successfully achieve their competitive and leading positions.","PeriodicalId":142478,"journal":{"name":"2006 IEEE Asian Solid-State Circuits Conference","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 IEEE Asian Solid-State Circuits Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASSCC.2006.357839","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
This presentation starts with evolution of the optical-storage chipsets for PC multimedia towards full-blown, next-generation SOC for digital consumer applications. Design challenges are reviewed and explored from submicron to nanometer eras in multiple levels of technology developments such as market-driven software/applications, advanced system architecture and engineering to address computation and connectivity requirements, performance-demanding but power-efficient circuit and functional blocks and the growing complexity being faced by increasingly large-scale chip integration. SOC companies will need to effectively cope with all incurred engineering issues to successfully achieve their competitive and leading positions.