Miniaturized LTE modem SiP using novel multiple compartments shielding

Abstract

This paper describes a miniaturized LTE SiP modem target for the smallest form factor among the product category. A Novel compartment shielding process is used to implement multiple shielded areas to reduce the interference between digital, analog and RF circuits. The result shows that this modem has excellent RF performance and meets all 3GPP LTE Category 3 (downlink speed can reach 100Mbps) and carrier's requirements. This SiP module passed FCC and CE EMI regulatory tests, and also passed GCF and PTCRB certification. Also, the reliability test shows this process meets consumer applications such as LTE modem for tablet. It is found that this compartment shielding process is good for consumer grade SiP module both in technology and in commercial terms.