Growth of Yttria-Stabilized Zirconia Thin Layer on Silicon Wafer Substrate (100) Using Pulsed Laser Deposition

Agusutrisno, A. K. Rivai, E. Suharyadi, M. Mardiyanto, M. A. Shulhany
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Abstract

Researches of a thin layer are one of the main studies in the materials on electronics. The deposition process of the yttria-stabilized zirconia (YSZ) thin film on a silicon wafer sub-strate (100) was carried out using pulsed laser deposition (PLD). The thin layer is grown for 50 minutes within frequency 10 Hz, pressure in the range 200-225 mTorr, Treatment of temperature in the silicon wafer as a deposit is 800°C. Furthermore, samples were characterized using an atomic force microscope (AFM), X-ray diffractometer (XRD), scanning electron microscope – energy dispersive spectroscope (SEM-EDS). This research shows that the thin film formed contains Zr4+ and Y3+ with the cubic and tetragonal phase crystal structure. The characterization of the roughness of thin film was very smoothly formed, with the range has 28 nm.
利用脉冲激光沉积在硅衬底上生长钇稳定氧化锆薄层
薄层的研究是电子材料研究的主要内容之一。采用脉冲激光沉积(PLD)技术在硅片衬底(100)上制备了钇稳定氧化锆(YSZ)薄膜。在10赫兹的频率下,在200-225 mTorr的压力范围内生长50分钟,硅片作为沉积物的处理温度为800°C。利用原子力显微镜(AFM)、x射线衍射仪(XRD)、扫描电镜-能谱仪(SEM-EDS)对样品进行了表征。研究表明,所形成的薄膜含有Zr4+和Y3+,具有立方相和四方相晶体结构。表征薄膜的粗糙度形成非常平滑,其范围为28 nm。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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