Experimental study of the melting of a solder paste

2017 XXVI International Scientific Conference Electronics (ET) Pub Date : 2017-09-01 DOI:10.1109/ET.2017.8124397

V. Tsenev, V. Videkov

引用次数: 1

Abstract

The report presents the results of a study of the melting of various solder pastes. The temperature distribution over time with convection heating, conductive and radiant was investigated. Sources of different heat output and different heating speeds were used. The results of cooling the paste are also presented.

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锡膏熔化的实验研究

报告介绍了对各种焊膏熔化的研究结果。研究了对流加热、传导加热和辐射加热下的温度随时间的分布。采用不同的热源输出热量和不同的加热速度。并给出了冷却膏体的结果。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 XXVI International Scientific Conference Electronics (ET)

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