Reliability and failure analysis of SnAgCu solder interconnections on NiAu surface finish

Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003 Pub Date : 2003-07-07 DOI:10.1109/IPFA.2003.1222749

P. Ratchev, B. Vandevelde, I. De Wolf

引用次数: 1

Abstract

The authors study the reliability and failure mechanisms of eutectic SnAgCu solder interconnects on NiAu surface finish. As a comparision, the reliability and failure mechanism of standard SnPb solder joints on SiAu surface finish is studied as well. The similarities and differences in the failure modes for both solders are analysed and discussed.

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NiAu表面处理下SnAgCu焊料互连的可靠性及失效分析

研究了在NiAu表面处理的共晶SnAgCu焊料互连的可靠性和失效机理。作为对比，研究了标准SnPb焊点在SiAu表面处理下的可靠性和失效机理。分析和讨论了两种焊料失效模式的异同。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 10th International Symposium on the Physical and Failure Analysis of Integrated Circuits. IPFA 2003

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