Applications of Two-State M-Integral to a Triple Junction Vertex Under Thermal Loading

S. Im, I. Jeon
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Abstract

The two-state M-integral, which is derived from the M-integral and is applicable for two elastic states, is applied for computing an intensity of a singular near-tip field around the vertex of a triple junction of three different materials under thermal loading, often encountered in electronic packaging. Numerically we verify that a simple auxiliary field associated with every eigenfunction for the composite wedge under consideration exists in the form of the conjugate solution in the sense of the M-integral. The auxiliary field is then employed for superposition with the elastic field under consideration, and the associated two-state M-integral is computed via the domain integral technique. This enables us to extract the intensity for a leading singular eigenfunction. The proposed computational scheme enjoys the efficiency and simplicity in that the near-field information for a singular elastic boundary layer is extracted from the domain integral representation without resort to singular finite elements for the wedge vertex.
热载荷下双态m积分在三结顶点上的应用
由m积分导出的适用于两种弹性状态的两态m积分,用于计算电子封装中经常遇到的三种不同材料的三结点在热载荷作用下顶点附近的奇异近尖场强度。在数值上证明了与所考虑的复合楔的每一个特征函数相关联的简单辅助场以m积分意义上的共轭解的形式存在。然后利用辅助场与考虑的弹性场进行叠加,并通过域积分技术计算相关的两态m积分。这使我们能够提取前导奇异特征函数的强度。本文提出的计算方案从域积分表示中提取弹性奇异边界层的近场信息,而不需要对楔形顶点进行奇异有限元计算,具有效率高、简单等优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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