Compact UWB Monopole Antenna for System-on-Package Applications

B. Sanz-Izquierdo, Q. Bai, P. Young, J. Batchelor
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引用次数: 3

Abstract

A novel compact, dual layer UWB monopole antenna is presented. This low profile ultra-wideband antenna is fed by a 50 Ω shielded strip-line with an array of metal vias making the conducting walls. A circular shaped monopole is the radiating element. The dual layer, shielded strip line feeding design characteristic of the antenna allows for integration in multilayer System-on-Package technologies. The ultra-wideband, monopole characteristics of the antenna are confirmed experimentally. INTRODUCTION Ultrawide-band communications systems have been investigated and developed over the last few decades. The technology promises high-speed transmission rate for short-range, indoor data communications. In 2002, the Federal communications Commission (FCC) allocated the spectrum from 3.1 to 10.6 GHz for unlicensed UWB measurement, medical and communication applications [1]. The frequency allocation has prompted the development of antennas and systems capable of covering the complete UWB frequency band. Antennas have been proposed for ultrawide-band applications in three dimensional [2],[3] and planar form [4], [5]. Planar monopole antennas have been developed with different shapes such as circular [4] and half disc [6]. Multilayer technologies have also attracted strong interest in recent years. Amongst them, technologies such as photo-imageable thick-film and LTCC (Low Temperature Co-fired Ceramic) offer compact multilayer solutions. In most cases, the ideal design requires a non-radiating transmission medium such as stripline [7] or substrate integrated waveguides [8]. This paper proposes a shielded strip-line fed UWB antenna design which can be integrated into multilayer circuit devices. The walls of the shielded strip line are formed using metal vias. The antenna is the disc shape proposed in [4] though is smaller in size when fabricated on the same permittivity substrate. Also, the feedline is better isolated from radiation and other circuitry when realized as shielded stripline. ANTENNA DESIGN: Fig.1. shows the proposed compact, dual-layer strip-line fed antenna and the reference antenna proposed in [4]. Both antennas have been designed to cover the UWB frequencies 3.1 and 10.6GHz and were fabricated using RT Duroid substrate of dielectric constant 2.33. The multilayer structure consisted of two layers of thickness 1.575mm with metal etched in the two sides of each substrate. The rectangular shape of the ground plane was produced by etching the top and bottom metal clad of the top and bottom layer respectively. The antenna was fed by a 50ohm shielded strip-line as illustrated in Fig.2. The stripline ground planes were terminated in the radiation region above and below the monopole disc which was 68 0-7803-9444-5/06/$20.00 © 2006 IEEE. metal vias strip line Wl ground planes L s r Ws Lg L d located between the 2 substrate layers. The side walls of the shielded strip transmission line were fabricated using two arrays of metallised vias of diameter 0.5mm and pitch 1mm. The separation between the two via arrays was 7.5 mm. A tapered transition was used between the radiating element and the transmission line. The other dimensions of the antennas are shown in table 1. Fig.1. Proposed dual layer design for system on package applications (left) and similar single layer arrangement in [4] (right). Table I. Dimensions of the multilayer Strip-line fed UWB antenna Fig.2. Geometry of the Dual-layer UWB antenna ANTENNA ANALYSIS AND EXPERIMENTAL RESULTS: Fig 3. Shows the simulated and measured return loss (S11) of the compact UWB antenna. The measured return loss was obtained using an HP 8722 ES network analyzer with coaxial calibration and CST Microwave Studio was used for the simulations. The calculated and measured -10dB S11 bandwidth achieves more than the 3 – 10.6 GHz needed for the UWB communication systems. Parameter Dimensions (mm) Ws 20 r 7.5 Ls 20 Ld 1.5 Lg 37 x y z
用于系统级封装应用的紧凑型超宽带单极天线
提出了一种新型的结构紧凑的双层超宽带单极天线。这种低轮廓的超宽带天线由50 Ω屏蔽带线馈电,带一系列金属过孔制成导电壁。圆形单极子是辐射元件。该天线的双层屏蔽带馈线设计特性允许集成多层系统级封装技术。实验证实了该天线的超宽带单极子特性。在过去的几十年里,超宽带通信系统得到了研究和发展。该技术保证了短距离室内数据通信的高速传输速率。2002年,联邦通信委员会(FCC)分配了3.1至10.6 GHz频谱,用于未经许可的UWB测量、医疗和通信应用[1]。频率分配促进了能够覆盖整个超宽带频段的天线和系统的发展。三维[2]、[3]和平面形式[4]、[5]的超宽带天线已经被提出。平面单极天线已发展成不同的形状,如圆形[4]和半圆盘[6]。近年来,多层技术也引起了人们的强烈兴趣。其中,光成像厚膜和LTCC(低温共烧陶瓷)等技术提供了紧凑的多层解决方案。在大多数情况下,理想的设计需要非辐射传输介质,如带状线[7]或衬底集成波导[8]。提出了一种可集成到多层电路器件中的屏蔽带线馈电超宽带天线设计方案。屏蔽带线的壁用金属过孔形成。天线是在[4]中提出的圆盘形状,尽管在相同的介电常数衬底上制造时尺寸较小。此外,当馈线实现为屏蔽带状线时,可以更好地隔离辐射和其他电路。天线设计:图1。给出了本文提出的紧凑型双层带状馈电天线和参考天线[4]。两种天线均设计为覆盖超宽带频率3.1和10.6GHz,采用介电常数2.33的RT Duroid衬底制作。多层结构由厚度为1.575mm的两层组成,每层基板的两侧蚀刻金属。分别对顶板和底板的金属包层进行刻蚀,得到矩形接地面。天线由50欧姆屏蔽带线馈电,如图2所示。带状线接地面终止于磁单极盘上下的辐射区域,其值为68 0-7803-9444-5/06/$20.00©2006 IEEE。金属通孔条线Wl接平面L s r w Lg L d位于2个衬底层之间。屏蔽带传输线的侧壁采用直径0.5mm、间距1mm的金属化过孔阵列制作。两个通孔阵列之间的间距为7.5 mm。在辐射元件和传输线之间采用了锥形过渡。天线的其他尺寸见表1。图1。提出了系统上封装应用的双层设计(左)和[4]中类似的单层安排(右)。表1多层带线馈电超宽带天线尺寸图双层超宽带天线的几何结构天线分析与实验结果:图3。给出了小型超宽带天线的回波损耗(S11)的仿真结果和实测结果。测量回波损耗使用HP 8722 ES网络分析仪进行同轴校准,并使用CST Microwave Studio进行模拟。计算和测量的- 10db S11带宽超过了UWB通信系统所需的3 - 10.6 GHz。参数尺寸(mm) w20 r 7.5 l20 Ld 1.5 l37 x y z
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