On chip measurement of I/sub C/(V/sub BE/) characteristics for high accuracy bandgap applications

W. Rahajandraibe, C. Dufaza, D. Auvergne, B. Cialdella, B. Majoux, V. Chowdhury
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引用次数: 0

Abstract

The E/sub G/ and X/sub TI/ coefficients are sufficient to completely characterise the temperature dependence of I/sub C/(V/sub BE/) relationship of bipolar transistors (BJT). They are usually obtained from measured V/sub BE/(T) values, using least square algorithm at a constant collector current. This method involves an accurate measurement of V/sub BE/ and of the operating temperature. We propose in this paper, a configurable test structure dedicated to the extraction of the temperature dependence of I/sub C/(V/sub BE/) characteristic for the BJT designed with bipolar or BiCMOS processes. This allows a direct measurement of the die temperature and consequently an accurate measurement of V/sub BE/(T). First, the classical extraction method is explained. Then, the implementation technique of the new method is discussed and finally, an improvement of a bandgap design is presented.
片上测量I/sub C/(V/sub BE/)特性,用于高精度带隙应用
E/sub G/和X/sub TI/系数足以完整表征双极晶体管(BJT) I/sub C/(V/sub BE/)关系的温度依赖性。它们通常在恒定集电极电流下使用最小二乘算法从测量的V/sub BE/(T)值获得。这种方法包括V/sub BE/和工作温度的精确测量。在本文中,我们提出了一个可配置的测试结构,专门用于提取双极或BiCMOS工艺设计的BJT的I/sub C/(V/sub BE/)特性的温度依赖性。这允许直接测量模具温度,从而精确测量V/sub BE/(T)。首先,对经典的提取方法进行了说明。然后讨论了新方法的实现技术,最后提出了一种改进的带隙设计方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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