{"title":"Doherty linear power amplifiers for mobile handset applications","authors":"Bumman Kim, Joongjin Nam, Daekyu Yu","doi":"10.1109/RWS.2007.351828","DOIUrl":null,"url":null,"abstract":"Two Doherty amplifiers are designed in MMIC form, which are fabricated using a commercial InGaP/GaAs HBT foundry process. The one is classical Doherty type amplifier with the size ratio of main device and auxiliary device of N=l, and the other is an extended Doherty with the size ratio of N=3. The input and output circuits are made using hybrid circuit, forming power amplifier modules. The efficiencies are improved about 18.8% at Pout = 23 dBm, about 5 dB backed-off point, from the size ratio N=l amplifier, and about 21% at Pout = 18.6 dBm, about 10 dB backed-off point, from the size ratio N=3 one. We have extended the technology to the fully integrated power amplifier chip. The amplifier shows an output power of 22.5 dBm and a power-added efficiency (PAE) of 21.3% at an error vector magnitude (EVM) of 5%, measured with 54 Mbps 64-QAM- OFDM signals at 5.2 GHz.","PeriodicalId":137931,"journal":{"name":"2006 Asia-Pacific Microwave Conference","volume":"136 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-04-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 Asia-Pacific Microwave Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RWS.2007.351828","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Two Doherty amplifiers are designed in MMIC form, which are fabricated using a commercial InGaP/GaAs HBT foundry process. The one is classical Doherty type amplifier with the size ratio of main device and auxiliary device of N=l, and the other is an extended Doherty with the size ratio of N=3. The input and output circuits are made using hybrid circuit, forming power amplifier modules. The efficiencies are improved about 18.8% at Pout = 23 dBm, about 5 dB backed-off point, from the size ratio N=l amplifier, and about 21% at Pout = 18.6 dBm, about 10 dB backed-off point, from the size ratio N=3 one. We have extended the technology to the fully integrated power amplifier chip. The amplifier shows an output power of 22.5 dBm and a power-added efficiency (PAE) of 21.3% at an error vector magnitude (EVM) of 5%, measured with 54 Mbps 64-QAM- OFDM signals at 5.2 GHz.