Ferroelectric Random Access Memory Using Pb(Zr,Ti,Nb)O3 Films

T. Kijima, T. Aoyama, H. Miyazawa, Y. Hamada, K. Ohashi, M. Nakayama, N. Furuya, A. Matsumoto, E. Natori, K. Tanaka, T. Shimoda
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Abstract

We have succeeded in fabricating Pb(Zr,Ti,Nb)O3 (PZTN) thin films with 20-atomic% Nb at B site in ABO3 structure, which was suitable for high density and reliable ferroelectric random access memory (FeRAM). A sol-gel spin-coating method was used to prepare the PZTN thin films. 1 mol% Si co-doping was applied to promote the solid-solution of Nb atom into the original Pb(Zr,Ti)O3 films. We suggested that in our PZTN the oxygen vacancies were well suppressed due to Nb substitution comparing with conventional Pb(Zr,Ti)O3 (PZT). We also succeeded in obtaining excellent electric properties in 1times1 mum2 capacitors with PZTN. In addition, we confirmed the no data degradation and the high reliability of our PZTN material has been demonstrated by 64 k-bits FeRAM chip operation.
基于Pb(Zr,Ti,Nb)O3薄膜的铁电随机存储器
我们成功地在ABO3结构中制备了B位Nb原子数为20%的Pb(Zr,Ti,Nb)O3 (PZTN)薄膜,该薄膜适用于高密度、可靠的铁电随机存取存储器(FeRAM)。采用溶胶-凝胶旋涂法制备了PZTN薄膜。采用1mol % Si共掺杂,促进Nb原子固溶到原Pb(Zr,Ti)O3薄膜中。我们认为,与传统的Pb(Zr,Ti)O3 (PZT)相比,在我们的PZTN中,由于Nb取代,氧空位得到了很好的抑制。我们还成功地用PZTN制备了1times1mum2电容器,获得了优异的电性能。此外,我们证实了PZTN材料的无数据退化和高可靠性已被64 k位FeRAM芯片操作证明。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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