Stress analysis and reliability of chip on board encapsulation technology

Abstract

It is shown that polymerization and thermomechanical stresses are important in miniaturized chip on board (COB) modules. COB technology is reliable enough to meet most of the demands from the market if the manufacturer has the process perfectly under control. There are two methods to check finite element method and ensure reliability of such miniaturized structures: (FEM) simulation and measurements with test die. FEM allows predictive calculations of stress which are verified by experiment. The FEM allows easy optimization during the design phase and provides a powerful tool to ensure the quality and reliability of low cost COB multichip modules.<>