{"title":"Current assisted photonic mixing demodulator implemented in 0.18μm standard CMOS technology","authors":"Q. D. Hossain, G. Betta, L. Pancheri, D. Stoppa","doi":"10.1109/RME.2009.5201367","DOIUrl":null,"url":null,"abstract":"CMOS image sensors integrate the image processing circuitry on the same chip as the light sensitive elements. Recently, lots of effort has been concentrated to create a standard CMOS photonic demodulator. A CMOS based current assisted photonic mixing demodulator is described in this paper. As a test vehicle, 10×10 pixel arrays in two different geometries have been fabricated with a 0.18μm CMOS technology. Remarkably small pixel size of 10×10 μm2 has been achieved. Preliminary experimental results demonstrate a good DC charge separation efficiency close to 100% and good demodulation capabilities up to 35MHz. The measurement results are compared to the performance of two different device array structures. These test devices represent the first step towards integrating a high resolution TOF based 3D CMOS image sensor.","PeriodicalId":245992,"journal":{"name":"2009 Ph.D. Research in Microelectronics and Electronics","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-07-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 Ph.D. Research in Microelectronics and Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RME.2009.5201367","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
CMOS image sensors integrate the image processing circuitry on the same chip as the light sensitive elements. Recently, lots of effort has been concentrated to create a standard CMOS photonic demodulator. A CMOS based current assisted photonic mixing demodulator is described in this paper. As a test vehicle, 10×10 pixel arrays in two different geometries have been fabricated with a 0.18μm CMOS technology. Remarkably small pixel size of 10×10 μm2 has been achieved. Preliminary experimental results demonstrate a good DC charge separation efficiency close to 100% and good demodulation capabilities up to 35MHz. The measurement results are compared to the performance of two different device array structures. These test devices represent the first step towards integrating a high resolution TOF based 3D CMOS image sensor.