{"title":"Subsurface microscopy of multilayered integrated circuits","authors":"F. H. Koklu, M. Unlu","doi":"10.1109/LEOS.2009.5343090","DOIUrl":null,"url":null,"abstract":"We demonstrate 325 nm lateral spatial resolution while imaging metal structures located inside the interconnect layer of a multilayered integrated circuit.","PeriodicalId":269220,"journal":{"name":"2009 IEEE LEOS Annual Meeting Conference Proceedings","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2009-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2009 IEEE LEOS Annual Meeting Conference Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/LEOS.2009.5343090","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We demonstrate 325 nm lateral spatial resolution while imaging metal structures located inside the interconnect layer of a multilayered integrated circuit.