SOLDER SEALING of CONNECTORS IN SOLID-STATE MICROWAVE MODULES. PROBLEMS AND SOLUTIONS

Abstract

This article presents the study of a promising technology utilizing the tin-lead solder for the sealing of current-transmitting components of modern solid-state microwave modules: connectors, leads and others. This technology was developed and implemented at the S&PE Pulsar JSC. The article highlights the advantages and disadvantages of the technique, presents the diagrams of the structures used.