Semiconductor Failure Analysis in Automotive Industry at BMW: from X-Ray Microscopy to ToF-SIMS Measurements on a STEM Lamella

ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis Pub Date : 2021-10-31 DOI:10.31399/asm.cp.istfa2021p0044

D. Braun, S. Diez, J. Kopitzke

引用次数: 0

Abstract

Considering the growing need for the use of semiconductors in the automotive industry, this paper aims to describe the analyzing process from an automotive manufacturer point of view. The use of X-Ray Microscopy and a combination of ToF-SIMS and FIB are shown.

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宝马汽车工业中的半导体失效分析:从x射线显微镜到STEM薄片上的ToF-SIMS测量

考虑到汽车工业对半导体使用的需求日益增长，本文旨在从汽车制造商的角度描述分析过程。显示了x射线显微镜的使用以及ToF-SIMS和FIB的组合。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

ISTFA 2021: Conference Proceedings from the 47th International Symposium for Testing and Failure Analysis

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