A 2.4GHz SOI CMOS Power Amplifier for New Generation Bluetooth Application

Ying Ruan, Lei Chen, Fang Yang
{"title":"A 2.4GHz SOI CMOS Power Amplifier for New Generation Bluetooth Application","authors":"Ying Ruan, Lei Chen, Fang Yang","doi":"10.1109/CCISP55629.2022.9974559","DOIUrl":null,"url":null,"abstract":"A 2.4GHz class E power amplifier (PA) for new generation Bluetooth Low Energy application is designed and implemented in 22nm silicon on insulator (SOI) CMOS technology. The proposed PA is fully integrated, which has a two-stage differential structure with cascode stacking power transistors to improve the efficiency and prevent the breakdown with almost no increase in die area. S parameter simulation results show that output impedance matching S22 is less than - 12.1dB in the frequency range from 2.4GHz to 2.5GHz. The power amplifier achieves a power gain of 15.9dB, output power of 4.9dBm, and a power added efficiency(PAE) of 41.5%.","PeriodicalId":431851,"journal":{"name":"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)","volume":"171 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 7th International Conference on Communication, Image and Signal Processing (CCISP)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/CCISP55629.2022.9974559","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

A 2.4GHz class E power amplifier (PA) for new generation Bluetooth Low Energy application is designed and implemented in 22nm silicon on insulator (SOI) CMOS technology. The proposed PA is fully integrated, which has a two-stage differential structure with cascode stacking power transistors to improve the efficiency and prevent the breakdown with almost no increase in die area. S parameter simulation results show that output impedance matching S22 is less than - 12.1dB in the frequency range from 2.4GHz to 2.5GHz. The power amplifier achieves a power gain of 15.9dB, output power of 4.9dBm, and a power added efficiency(PAE) of 41.5%.
用于新一代蓝牙应用的2.4GHz SOI CMOS功率放大器
采用22nm硅绝缘体(SOI) CMOS技术,设计并实现了一款适用于新一代低功耗蓝牙应用的2.4GHz E类功率放大器。所提出的PA是完全集成的,采用级联堆叠功率晶体管的两级差分结构,在几乎不增加芯片面积的情况下提高了效率并防止了击穿。S参数仿真结果表明,在2.4GHz ~ 2.5GHz频率范围内,与S22匹配的输出阻抗小于- 12.1dB。该功率放大器的功率增益为15.9dB,输出功率为4.9dBm,功率附加效率(PAE)为41.5%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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