Defects Determination and Diagnosis in Bare Dice for High Reliable Hybrid Microcircuits

Abstract

Defects visualization in bare chips and dice are important for realization of high reliable aerospace systems. Various defects such as cracks, voids, delamination, chip outs, dis-coloration, deep scratches can be detrimental in long term reliability of the Hybrid Microcircuits (HMCs). In spite of various standards in the realization of dice as well as various inspection formulating methodologies still probability of defects induced during fabrication and packaging need to be critically examined. Further handling and assembly of the dice can also induce certain defects due to various stresses which will impact on product quality. This paper provides an overview of various visual defects observed in bare dice and further tests and analysis to know the impact on electronic fabrication process.