First Demonstration of High PAE Performance Using InGaN Channel HEMT for 5G RF Applications

Hao Lu, Likun Zhou, Longge Deng, Ling Yang, Bin Hou, Xiao-hua Ma, Yue Hao
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Abstract

The conventional GaN channel HEMT will suffer the significant short channel effect and high-temperature degradation due to its weak channel confinement. Although the InGaN channel double-heterostructure HEMT (DH-HEMT) has been reported to address this issue well due to the strong quantum confinement, the efficiency of the InGaN channel lacks investigation. In this work, a high PAE performance of the InGaN channel heterostructure has been reported for the first time. The fabricated InGaN channel device with a gate length of 200-nm achieved a high fT/fmaxof 36.7 and 97 GHz, respectively. 3.6 GHz continuous-wave load-pull measurements gain a high power-added efficiency (PAE) of 59.4 %, and an associated output power density (Pout) of 2.14 W/mm at VDS= 20 V. It is the first time for the InGaN channel achieved so high PAE performance, the results presented here are benchmarked against the state-of-the-art (SOA) InGaN channel. This work illustrated that the InGaN channel with reasonable design can boost the 5G base-station applications.
5G射频应用中首次使用InGaN信道HEMT实现高PAE性能
传统的氮化镓HEMT通道由于其弱通道约束,将遭受明显的短通道效应和高温降解。虽然有报道称InGaN通道双异质结构HEMT (DH-HEMT)由于其强量子约束而很好地解决了这一问题,但对InGaN通道的效率缺乏研究。在这项工作中,首次报道了InGaN通道异质结构的高PAE性能。所制备的栅极长度为200 nm的InGaN通道器件分别获得了36.7 GHz和97 GHz的高fT/fmax。3.6 GHz连续波负载-拉力测量在VDS= 20 V时获得59.4%的高功率附加效率(PAE)和2.14 W/mm的相关输出功率密度(Pout)。这是InGaN通道首次实现如此高的PAE性能,本文给出的结果是针对最先进的(SOA) InGaN通道进行基准测试的。研究表明,设计合理的InGaN通道可以促进5G基站的应用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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