A new method for measuring the tin content of flip-chip solder bumps

Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium Pub Date : 1993-10-04 DOI:10.1109/IEMT.1993.398213

H. Katô, K. Ikuzaki, M. Tsujita, K. Nakata, T. Kobayashi, Y. Sano

引用次数: 0

Abstract

A new method for measuring the tin content of flip-chip solder bumps is described. This method uses a combination of gravimetric analysis and fluorescent X-ray spectrometry, which allows it to measure low Sn ratio of less than 2%. It also improves the repeatability to 0.2% compared with 4.3% for conventional methods that use integrated circuit piezoelectric (ICP) atomic emission spectrometry. This method also reduces the measurement time by 75%.<>

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一种测量倒装片焊点锡含量的新方法

介绍了一种测量倒装片焊点锡含量的新方法。该方法结合了重量分析和荧光x射线光谱法，可以测量小于2%的低锡比。它还将重复性提高到0.2%，而使用集成电路压电(ICP)原子发射光谱法的传统方法的重复性为4.3%。该方法还可将测量时间缩短75%。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of 15th IEEE/CHMT International Electronic Manufacturing Technology Symposium

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