The effects of chemical cleaning on impregnant removal as a function of impregnant type [dispenser cathodes]

J. Farrell, S. Conkwright, J. Tarter
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引用次数: 0

Abstract

Summary form only given. A liquid cleaning technique, commonly referred to as SRLV or EDTA cleaning, is often used to clean the emitting surface of dispenser cathodes. The process is based on chemical chelating and removes a shallow layer of impregnant material from the impregnated tungsten matrix. This produces a cathode with more predictable activation behavior and reduces initial evaporation products. Additionally, a thoroughly cleaned surface enhances sputtered coatings adhesion. This investigation reports on the amount of impregnant removed as a function of impregnant type and as a function of time. Methods used to evaluate the amount of material removed include copper back filling and metallographic sampling. Variability in the data is primarily due to the complexity of the BaO-CaO-Al/sub 2/O/sub 3/ oxide system and the impregnation process.
化学清洗对浸渍物去除的影响(浸渍物类型的函数)
只提供摘要形式。液体清洗技术,通常被称为SRLV或EDTA清洗,通常用于清洗分点阴极的发射表面。该工艺基于化学螯合,并从浸渍钨基体中去除一层浅层浸渍材料。这产生了具有更可预测的激活行为的阴极,并减少了初始蒸发产物。此外,彻底清洁的表面可以增强溅射涂层的附着力。本调查报告了作为浸渍类型和时间函数的浸渍去除量。用于评估移除量的方法包括铜回填和金相取样。数据的变化主要是由于BaO-CaO-Al/sub - 2/O/sub - 3/氧化物体系和浸渍过程的复杂性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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