Statistical variability in scaled generations of n-channel UTB-FD-SOI MOSFETs under the influence of RDF, LER, OTF and MGG

S. Markov, A. Zain, B. Cheng, A. Asenov
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引用次数: 30

Abstract

Statistical variability (SV) critically affects the scaling, performance, leakage power, and reliability of devices, circuits, and systems [1]. The good electrostatic integrity of UTB-FD-SOI transistors tolerates low channel doping and dramatically reduces the statistical variability due to random dopant fluctuations (RDF), but other sources of variability remain pertinent, including line edge roughness (LER), metal gate granularity (MGG) leading to work-function variation (WFV), oxide thickness fluctuations (OTF), and interface trapped charge due to NBTI/PBTI [2-4]. The different physical nature of these phenomena affects the spread of threshold voltage (Vth), on-current (Ion), and DIBL of the transistors in different ways, and is, for the first time, comprehensively studied here for three LOP-technology generations of n-channel UTB-FD-SOI devices with a physical gate length LG of 22, 16, and 11 nm.
RDF、LER、OTF和MGG影响下n沟道UTB-FD-SOI mosfet的统计变异性
统计可变性(SV)严重影响器件、电路和系统的缩放、性能、泄漏功率和可靠性。UTB-FD-SOI晶体管良好的静电完整性可以耐受低通道掺杂,并显著降低了随机掺杂波动(RDF)引起的统计变异性,但其他变异性来源仍然相关,包括线边缘粗糙度(LER)、导致功函数变化(WFV)的金属栅粒度(MGG)、氧化物厚度波动(OTF)和NBTI/PBTI引起的界面捕获电荷[2-4]。这些现象的不同物理性质以不同的方式影响晶体管的阈值电压(Vth)、导通电流(Ion)和DIBL的扩散,本文首次对物理栅长LG为22、16和11 nm的三代lop技术n通道UTB-FD-SOI器件进行了全面研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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