Automation of assembly and packaging at the micro/nano-scale

2011 IEEE International Conference on Automation Science and Engineering Pub Date : 2011-10-13 DOI:10.1109/CASE.2011.6042531

M. Rakotondrabe, Y. Haddab, C. Clévy, P. Lutz

引用次数: 2

Abstract

This paper provides a general overview of the material covered in the fullday workshop with the same title devoted to the field of automation in microassembly and packaging at the micro/nanoscale.

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微/纳米级的装配和包装自动化

本文提供了全天研讨会中所涵盖的材料的总体概述，该研讨会致力于微/纳米尺度上的微组装和封装自动化领域。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2011 IEEE International Conference on Automation Science and Engineering

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