Laser Drilling of a 7-layer Flexible Printed Circuit Board using a Pulsed Ytterbium Fiber Laser System

Abstract

Recently, laser-processing industry is becoming increasingly popular because of its advantages of low cost, fast and good energy efficiency. The electric circuit board manufacturers also began to import related laser processing technology to improve the productivity. This paper presents the laser drilling process and quality analysis of the 7-layer flexible printed circuit (FPCB). A laser drilling system pulsed Ytterbium fiber laser, expander device, focal lens, galvanometric scanner and XY-axis manual stage was used to perform the hole cutting of the multilayer-layer FPCB. This study succeeded in establishing a comparing procedure, which enabled the characteristic comparison between the various experimental conditions. We believe that this study provides a useful database for FPCB drilling technology.