{"title":"A novelapprochof graphene-based composite thin films for electronics applications","authors":"G. Arthi, S. Balaji, J. Jaya","doi":"10.1109/ICCTET.2013.6675943","DOIUrl":null,"url":null,"abstract":"The electrical properties of solution-processed composite thin films, consisting of functionalized graphene sheets (FGS) as the filler and polystyrene (PS) as the host material are described. We demonstrate that transistors from graphene-based composite thin films exhibit ambipolar field effect characteristics, suggesting transport via percolation among FGS in the insulating PS matrix. Device characteristics as a function of the [1]FGS size are also reported. The results indicate that devices fabricated using the largest size FGS yield the highest mobility values. This simple and scalable fabrication scheme based on a commodity plastic could be useful for low-cost, macro-scale electronics.","PeriodicalId":242568,"journal":{"name":"2013 International Conference on Current Trends in Engineering and Technology (ICCTET)","volume":"3 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 International Conference on Current Trends in Engineering and Technology (ICCTET)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICCTET.2013.6675943","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The electrical properties of solution-processed composite thin films, consisting of functionalized graphene sheets (FGS) as the filler and polystyrene (PS) as the host material are described. We demonstrate that transistors from graphene-based composite thin films exhibit ambipolar field effect characteristics, suggesting transport via percolation among FGS in the insulating PS matrix. Device characteristics as a function of the [1]FGS size are also reported. The results indicate that devices fabricated using the largest size FGS yield the highest mobility values. This simple and scalable fabrication scheme based on a commodity plastic could be useful for low-cost, macro-scale electronics.