Improving design turnaround time via two-levels HW/SW co-simulation

A. Allara, S. Filipponi, W. Fornaciari, F. Salice, D. Sciuto
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引用次数: 0

Abstract

The steadily growing demand of fast turnaround time will shift system tuning from physical prototyping to virtual prototyping. The paper proposes a novel approach for mixed HW-SW implementation of embedded systems, allowing high-level simulation of the overall architecture as well as a deeper analysis of timing performance by exploiting commercial VHDL CAD tools. At the higher level, functional debugging and tradeoff analysis is performed on an OCCAM-based system-level model and at the lower level a VHDL-based description for both the HW and SW is built for fine grain verification of the system. The paper introduces the two levels of simulation, showing their impact in terms of design flow management and design time.
通过两级硬件/软件联合仿真提高设计周转时间
快速周转时间需求的稳步增长将使系统调优从物理原型转向虚拟原型。本文提出了一种用于嵌入式系统混合HW-SW实现的新方法,允许对整体架构进行高级模拟,并通过利用商用VHDL CAD工具对时序性能进行更深入的分析。在较高的级别上,在基于occam的系统级模型上执行功能调试和权衡分析,在较低的级别上,为硬件和软件构建基于vhdl的描述,以进行系统的细粒度验证。本文介绍了仿真的两个层次,展示了它们在设计流程管理和设计时间方面的影响。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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